1010wA/1010B high temperature bonding with epoxy resin
I. Introduction:
1010WA / B series high-performance epoxy resin imported amine curing agent composition and diversity of material, a mixture of low viscosity, can be used for a long time, after curing, high hardness, heat resistance up to 200 degrees, excellent electrical characteristics can be arbitrarily adjusted according to customer requirements color.
Second, the conventional performance:
Test items or conditions 1010WA 1010B test methods
Appearance white liquid transparent liquid measuring head
Density 25 ℃ g/cm3 1.1 ~ 1.2 1.01 ~ 1.05
Viscosity 40 ℃ mpa • s 18000-25000 80-120
Ventilation from year to year shelf life at room temperature


Temperature

200 degrees

High hardness

Black

White

Red
Third, use:
Item Unit or condition 1010WA/1010B
Mixing ratio of 100:10 by weight
You can use the time 25 ℃, hrs 1
Curing conditions ℃ / hrs 60 degrees / 25 degrees or 2-3 hours / 24 hours
Note: If you need stripping, first to silicone oil in the inner surface of the mold steel brushing a layer of uniform, and then placed in 150-degree oven, pre-bake 1 hour, cooled, silicone oil in the steel mold inner surface of the isolation layer will be formed, and then will be prepared, stir well mixed AB glue, into the mold, then 80 ° / 4 hours to +140 ° / 3 hours curing, cooling after ejection can be!
 
1 tool: electronic scales, measuring cups (such as: plastic cups, paper cups), glass (or mixing gun); 1010WA 70-degree cold warm when needed 2 hours, a viscosity-thinning, easy to operate.
2 Weighing: on electronic scales, placed above the measuring cup to remove tare, add 100 grams of adhesive A, B and then add 10 grams of plastic. (Note: 1 weight ratio must be some customers without electronic scales, the amount of his take on the use of graduated cylinder which is not desirable, because the proportion of different AB glue, it is difficult to achieve a suitable proportion of cases, so with good cause glue does not harden. 2 do not increase by more or less glue B to control the rate of hardening of the glue, otherwise it might not harden.)
3 mixing: mixing the weighed AB glue, stir with a glass rod (vertical and horizontal rotation) about 3 minutes, (Note: if uneven mixing, may lead to local non-hardening phenomenon.)
4 packages: the stirred mixture of glue, one by one into the pre-prepared products (preferably in a half hour run out to prevent the glue in chemical reactions produce large amounts of heat, leading to a rapid increase in viscosity of the glue, short rapid hardening).
5 Cure: 60 degrees / 80 degrees or 2-3 hours / 2 hours
 6 Clean: You can use acetone or ethanol.
  The Advantages: bright white, smooth surface, high temperature, good electrical insulation properties!
Fourth, use:
    Modules for electrical components such as cast molding. Most materials can be bonded.
 Fifth, the curing characteristics:
Item Unit or condition 1010WA/1010B
Hardness Shore-D> 85
TG ℃> 125
Volume resistivity 25 ℃, Ω • cm 1.5 × 1015
Surface resistivity of 25 ℃, Ω 1.2 × 1014
Dielectric strength of 25 ℃, kV / mm> 20
Dielectric constant of 25 ℃, 1MHZ 4.2 ± 0.1
Dielectric loss tangent 25 ℃, 1MHZ <0.01
Compression strength kgf/mm2> 30
Bending strength kgf/mm2> 15
Impact strength kgf/mm2> 5.1
Shrinkage% <5
 Sixth, storage, transportation and precautions:
1. Such products of non-dangerous goods, as a general chemical storage and transportation, see the product shelf life drum.
2. Please use the sights on the product model, then the condemnation; accurate weighing, please fully stirred; weighing more than 200 grams, the use period will be shortened.
3. Customers can add their own creams according to actual needs and filling.
7, Packing specifications:
    Packing for the A: 20KG ± 90g iron or 200KG / drum; B: 5KGG ± 90g plastic barrels or other containers.
 
* Note: The above performance data for the product in 70% humidity, temperature 25 ℃, the typical test data for customers reference, and can not guarantee that in a specific environment can be achieved when all the data. Please use the customer, subject to the measured data